SEMATECH, Novellus partner on ultra low-k deposition and UVTP curing

June 7, 2005-Novellus Systems Inc. and global technology research consortium SEMATECH are partnering to develop and evaluate low-k dielectric films with k values <2.2, and explore the limits of ultra low-k integration. As part of the joint development agreement, SEMATECH will purchase a VECTOR PECVD system for depositing ultra low-k films and a ultraviolet thermal processing (UVTP) system for post-deposition film curing.

Both systems will be delivered to SEMATECH in October. Novellus will provide bulk film development and support, while SEMATECH will contribute its technical expertise in the integration of porous low-k films.

SEMATECH has designated low-k dielectrics and process compatibility as one of its top challenges for 2005 and 2006, as part of its exploration of the limits of integrating porous low-k materials. In addition to identifying and evaluating ultra low-k materials, the consortium’s engineers also are working to ensure that low-k structures reflect a k-effective value of 2.5 for the 45nm technology node.

“We’re pleased to be working with a willing partner whose aggressive roadmap matches ours,” said Klaus Pfeifer, program manager of copper low-k module integration at SEMATECH. “Through this project on low-k deposition and curing technologies, we will aim to help our member companies understand and resolve integration issues for porous dielectrics and accelerate the implementation of ultra low-k films into volume production.”


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.