June 23, 2005 – PowerChip Semiconductor Corp. (PSC), ProMos Technologies Inc., and Nanya Technology Corp. have raised a total NT$43.5 billion (US$1.4 billion) for expansions in the first half of 2005, said the Taiwan Economic News. The three DRAM chipmakers will mostly spend the capital on expansions at their 300mm silicon-wafer foundry plants.
PSC plans to boost output capacity to 30,000-35,000 wafers/month at its 300mm wafer fab at year’s end from a current level of 20,000-25,000 wafers. It has projected to spend an additional NT$10 billion (US$322.5 million) on expansion throughout 2005, floating its total outlay for this year to NT$50 billion. The expansion will allow its output of double data rate (DDR) 2 memory chips to rise to account for 40% of its total output next quarter. The company alone has raised NT$16 billion by issuing 300 million new shares.
ProMos Technologies plans its capital expenditure for this year at US$800 million. The company projects to begin shipping DDR2 chips in big volume in the 4Q this year. The company signed a syndicate loan of NT$10 billion (US$322.5 million) with 11 banks in February this year. It raised an additional NT$7 billion this month by issuing new shares overseas. ProMos began first-phase pilot production at its 300mm wafer fab in Central Taiwan Science Park a few days ago and will launch second-phase pilot production shortly. The company originally planned to kick off the pilot runs late next quarter. However, earlier-than-scheduled completion of the factory’s cleanroom allowed the schedule to be moved forward.
Nanya plans to boost its output of DDR2 chips to account for ~70% of its total output at year’s end from its current ~20%. The company has raised NT$10.4 billion (US$335 million) by issuing unsecured debentures. It is planning to raise NT$8 billion in 2H05.