Axcelis enters low-k curing JDA with Asian chipmaker

July 7, 2005 – Axcelis Technologies Inc. has entered into a joint development agreement for advanced low-k film curing with one of the world’s largest IC manufacturers based in the Asia Pacific region. The development program is focused on evaluating and integrating low-k dielectric materials for 45nm device designs.

At the heart of the joint development effort is Axcelis’ RapidCure 320FC low-k film curing platform, which will ship this month. Axcelis’ UV-based curing technology strengthens low-k films and improves their dielectric properties, ensuring their suitability for use in advanced devices.

Mary Puma, chairman and CEO of Axcelis Technologies, said that the joint development agreement builds on a long-standing relationship between the two companies.


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