Eco-Snow Systems introduces new, dry semiconductor wafer cleaning process

Plasma-free process for stripping high dose implanted photoresists eliminates silicon loss and oxide growth

SAN FRANCISCO, CA (July 11, 2005)-Eco-Snow Systems, a member of The BOC Group (NYSE: BOX), and the leading supplier of dry carbon dioxide (CO2) snow-based wafer cleaning tools, has introduced a new process for semiconductor wafer cleaning that eliminates the negative side effects of traditional plasma cleaning.

Semiconductor manufacturers and cleaning process engineers looking for cost-effective ways to strip high dose implanted resist can use Eco-Snow’s new dry process to get the same high throughput and low ownership costs as traditional plasma cleaning processes. But unlike oxygen plasma cleaning, the new, CO2-based dry process won’t promote any oxide layer growth, silicon loss or mobile ion diffusion, which can negatively affect device performance. The new process also can be combined with conventional wet cleaning to achieve the required surface conditioning of the semiconductor wafer surface.

The process is conducted in a new cleaning tool from Eco-Snow called WaferClean 3600′, which is capable of processing both 200 and 300 mm wafers. The tool will be available in modular or standalone configurations for easy integration with customers’ existing manufacturing processes.

The WaferClean 3600 cleaning tool also can be used for damage-free, sub-micron particle removal from wafers. The one-step, all-dry process offers manufacturers flexible conditions for removing particles without the detrimental effects of poly silicon or oxide film etch. It also eliminates any damage from traditional, megasonic cleaning processes.

“The particle removal process can also be used for photo mask, MRAM, MEMS, compound and back-end assemblies, such as imaging devices. It can be used to supplement or supplant existing wet cleaning operations,” said Joe Clark, general manager, Eco-Snow Systems.

For more information about these and other dry-cleaning offerings visit Eco-Snow at SEMICON(r) West July 12-14 in the South Hall, booth #902.

Editor Background
The global electronic packaging industry looks to BOC for its knowledge, skill and experience in developing reliable solutions for their manufacturing needs, from wafer-level packaging to systems assembly and testing. Eco-Snow Systems experts have years of industry experience and have developed proven and highly efficient precision cleaning technologies to enhance or enable new generations of electronic manufacturing processes, and address customers’ productivity, environmental and economic challenges at their facilities worldwide.

The BOC Group (NYSE:BOX), the worldwide industrial gases, vacuum technologies and distribution services company, is a leader in providing cutting edge solutions to the global electronics packaging industry. Through BOC, Eco-Snow can serve customer’s cleaning needs at any location around the world, providing solutions and support worldwide. BOC serves two million customers in more than 50 countries. It employs some 30,000 people and had annual sales of over $8.3 billion in 2004. Further information about The BOC Group may be obtained on the Internet at

Kristina Schurr
BOC communications
[email protected]

Virginia Becker
BOC Edwards communications
[email protected]


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