July 6, 2005 — EV Group, a manufacturer of MEMS, nano and semiconductor wafer-processing equipment, announced the installation of an EVG620 precision alignment system for nanoimprint lithography at Stanford Nanofabrication Facility at Stanford University.
The tool has capabilities for UV molding and micro contact printing and can realize feature sizes down to the sub-100 nm range. Further systems from EV Group for cleaning, double-side alignment and wafer bonding have been previously installed at Stanford for advanced MEMS research, including the EVG620 precision mask and bond aligner, the EVG501 wafer bonder and the EVG301 wafer cleaner.