(July 12, 2005) Morris Township, N.J. — Honeywell’s Electronic Materials business will expand its Asia-Pacific manufacturing capabilities to include 300-mm PVD (physical vapor deposition) sputtering targets production. Since the Asia-Pacific region is critical, the Jincheon, Korea-based plant will provide customers with technology materials for semiconductor production. Current capabilities at the site include production of materials supporting 200-mm semiconductor manufacturing.
Slated for completion by late 2005, Honeywell’s new Asia-Pacific 300-mm PVD target manufacturing is part of the company’s overall commitment to the region, where chips are increasingly manufactured for export worldwide. Honeywell also manufactures 300-mm PVD targets at its Spokane, Wash. facility.
“Honeywell Electronic Materials is uniquely qualified to serve the increasingly complex needs of global semiconductor manufacturers,” says Barry Russell, VP and general manager for the Honeywell Electronic Materials business. “The production of ICs involves hundreds of processing steps that are impacted by the material choices made by our customers. While other materials suppliers offer limited product lines backed by singular expertise, we have carefully designed the business to combine the disciplines of chemistry and metallurgy across the front-end (wafer processing) and back-end (packaging) as we develop solutions to the challenges our customers are facing.”