Intel, Corning Team for EUV Photomask Substrates

(July 7, 2005) Corning, N.Y. &#8212 Intel Corp. and Corning Inc. are joining forces in an agreement to develop ultra-low thermal expansion ULE glass photomask substrates required for extreme ultraviolet (EUV) lithography technology. These substrates are needed to develop low-defect EUV photomasks to enable 32-nm node high-volume production using EUV lithography. The joint development program will help to enable chip production using EUV technology by 2009.


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