(July 13, 2005) Jerusalem, Israel &#8212 Wafer-level electronics miniaturization technologies provider Shellcase Ltd. has licensed use of its wafer-level chip-size packaging (WLCSP) platforms to Suzhou, China-based packaging services provider China WLCSP.

(July 14, 2005) San Francisco, Calif. &#8212 Top executives from the semiconductor equipment and materials industry engaged in a debate over the industry’s future on SEMICON West’s opening day. One question addressed was whether the center of the industry will inevitably shift away from North America toward Asia, reflecting the Asia-Pacific market’s growing size and importance.