Shellcase licenses to China WLCSP

July 12, 2005 — Shellcase Ltd., a provider of wafer-level electronic product miniaturization technologies headquartered in Jerusalem, announced it has licensed the use of its wafer-level chip size packaging platforms to a Chinese packaging services provider, China WLCSP, based in Suzhou, China.

Shellcase’s platforms are designed to enable savings in board space and overall assembly costs for manufacturers of semiconductor devices, including CMOS and CCD area array and linear sensors, photodiodes, and RF-MEMS and mixed signal devices.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.