Introduced in the late 1990s, Amkor’s MLF package has seen accelerating adoption by IC suppliers as a cost-effective alternative for conventional, low-lead-count packages. In the past 3 years, Amkor has shipped more than two billion MLF packages. “This agreement recognizes Amkor’s substantial, ongoing investments in MLF technology and intellectual property, and its adoption as a preferred packaging solution,” according to Terry Davis, Amkor’s VP for MLF packages.
“This agreement provides GEM with the flexibility and option to access Amkor’s MLF patents to help satisfy our customers’ growing demand for power management products required by portable, battery-powered communications and computing systems,” says Richard J. Kulle, GEM’s president and CEO.