Global orders for Japanese chipmaking gear down 22% in June

August 1, 2005 – Global orders for Japanese-made chipmaking equipment in June fell 22.0% from a year earlier to 128,315 million yen (US$1140 million), the Semiconductor Equipment Association of Japan said Thursday, according to JiJi. Though orders posted the third straight year-on-year drop, the association said demand for Japanese semiconductor-making equipment is on a recovery path as the value of the orders topped 100 billion yen.

Orders from North America rose, but the increase was more than offset by declines elsewhere, it said. By product, orders for wafer-processing equipment fell 20.6% to 82,123 million yen, while testing equipment orders were down 20.5% at 32,166 million yen.

Global sales of Japanese chipmaking equipment in the reporting month decreased 28.4% to 112,372 million yen, down for the fifth consecutive month.

Meanwhile, orders in Japan for chipmaking gear manufactured by Japanese and foreign makers increased 18.9% to 101,238 million yen, following a 33.8% drop in May.

The SEAJ warned it would be premature to judge that the rebound in June would lead to rises in July and beyond.

Orders for wafer-processing equipment grew 29.1% to 73,773 million yen, and those for testing devices increased 32.6% to 16,582 million yen, marking the first rise in 10 months.

Overall sales, however, decreased 20.5% to 60,265 million yen, down for the sixth consecutive month.


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