Japan July chip equip orders down 28% on year

August 19, 2005 – Global orders for Japanese semiconductor manufacturing equipment decreased 28.3% in July from a year earlier to Y112.84 billion (US$1.02 billion), according to preliminary data released Thursday by an industry association, said the Nikkei English News.

The book-to-bill ratio for Japanese chipmaking equipment manufacturers came to 1.08 in July, topping the key 1.00 mark for the second straight month, the Semiconductor Equipment Association of Japan said in a press release.

The ratio stood at 1.09 in June and 0.91 in May.

The book-to-bill ratio measures the amount of new orders compared with the amount of actual products shipped. A ratio higher than 1.00 means new orders outpaced shipments, implying a good business outlook.


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