August 30, 2005 – MEMC Electronic Materials Inc. says that it has become the world’s first producer of 300mm wafers in Taiwan; production starts today at its Taisil facility in Hsinchu, Taiwan.
The Taisil facility is targeted to reach a 300mm capacity of approximately 150,000 wafers per month by the end of 2006, depending upon market demand. With MEMC’s 300mm capacity at its Japan facility expected to reach approximately 200,000 wafers per month later this summer, this expansion in Taisil would bring MEMC’s total 300mm capacity to approximately 350,000 wafers per month by the end of 2006.
MEMC and a group of partner companies established Taisil in 1994, making it the first manufacturer of 200mm silicon wafers in Taiwan. In 2004, MEMC acquired the remaining assets of Taisil and embarked on an aggressive program to bring 300mm capability into Taiwan to meet growing demand.
“We are very pleased with the dedication of our employees, as well as the support of our suppliers and customers in helping us achieve this strategically important milestone,” said Nabeel Gareeb, MEMC’s CEO. “In keeping with our March 2004 announcement regarding the expansion of 300mm capacity, the start of production at Taisil gives us the opportunity to expand our presence in one of the fastest growing regions in the world. In addition, it allows us to supply 300mm wafers from multiple geographic locations to support the growing worldwide demand.”
“As market conditions dictate, we can install sufficient equipment within Taisil to produce approximately 400,000 300mm wafers per month without impacting 200mm wafering capability. This would allow us to achieve a global capacity of approximately 600,000 300mm wafers per month within the existing MEMC infrastructure,” concluded Gareeb.