(August 11, 2005) Phoenix, Ariz. &#8212 RoseStreet Labs (RSL) has opened their 3-D Research and Development laboratory for next-generation semiconductor packaging. Along with their subsidiary, FlipChip International, they will develop new materials and processes for packaging used in wireless products. Also, RSL’s alliance with SUSS MicroTec allows RSL to use SUSS’ full suite of lithography and 3-D packaging equipment in the new lab.

(August 11, 2005) Chandler, Ariz. &#8212 Amkor Technology and GEM Services have signed a broad, multi-year patent license agreement, allowing GEM to practice under Amkor’s MicroLeadFrame (MLF) patents portfolio. MLF is Amkor’s version of an IC package classified as a quad-flat-pack-no-lead (QFN), and is a leadframe-based, nearly chip scale package with an exposed die paddle and leads on the package’s bottom.