RoseStreet opens new lab with Suss tools

Aug. 11, 2005 — RoseStreet Labs announced the opening of its 3D R&D lab for next generation semiconductor packaging and also announced an alliance with SUSS MicroTec. SUSS’s lithography and 3D packaging equipment was selected for RoseStreet’s laboratory.

RoseStreet, headquartered in Phoenix, Ariz., offers contract R&D services in addition to its internal R&D work to support its subsidiary FlipChip International’s flip chip and wafer level packaging product lines. RoseStreet and Flip Chip develop new materials and processes for packaging utilized in wireless products.


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