RSL opens packaging R&D lab with Suss MicroTec

August 10, 2005 – RoseStreet Labs (RSL), Phoenix, AZ, has announced the opening of its 3D Research and Development laboratory for next-generation semiconductor packaging, as well as an alliance with Suss MicroTec, which will provide the lab with a full suite of lithography and 3D packaging equipment. RSL and its subsidiary, FlipChip International, develop packaging materials and processes used in wireless products. RSL R&D offers contract R&D services in addition to its internal R&D work in support of FlipChip International’s flip-chip and wafer-level packaging product lines.

Bob Forcier, RSL president and CEO, said, “This opening of our new R&D lab and our alliance with our close partner, Suss MicroTec, is part of our five-year technology roadmap to provide next-generation solutions to our valued customers in the areas of wafer-level MEMs, sensor, system-in-package, and advanced 3D packaging.”


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