One looming challenge faced by the U.S. industry is compliance with the European Union Directive on Restriction of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS), effective July 2006. RoHS restricts lead used in solders, mercury, cadmium, hexavalent chromium used to inhibit corrosion, and polybrominated biphenyls (PBBs) and polybrominated diphenyl ether (PBDE) flame retardants used in plastic housings of electrical appliances.

Shanghai, China &#8212 Advanced Packaging Magazine sister publications, SMT and SMT China, along with the China Electronics Appliance Corporation (CEAC), announce the Call for Papers for the 2005 SMT China International Conference on Emerging Technologies & Lead-free Challenges. Held annually, SMT and SMT China Magazines will focus on SMT, emerging technologies, and hot topics for modern assembly methods. The conference will be held on November 21-22, 2005, in conjunction with the CEAC’s 66th China Electronic Fair (CEF) at the Shanghai International Convention Center.