ASE bounces back to pre-fire levels

September 8, 2005 – Advanced Semiconductor Engineering Inc. (ASE) has bounced back nearly to levels before a fire struck its Chungli facilities in early May, causing an estimated $148 million in damages, according to the Taiwan Economic News. August revenues were $24 million, said spokesperson Joseph Tung, with packaging output at full capacity and test capacity right behind.

He added that his company saw monthly revenue hit a new high last month and expected its September revenue to top NT$8 billion (US$258 million at US$1:NT$31). Tung stressed that his company already listed loss from the fire on its accounting books, freeing its financial reports from the impact of the loss.

His company already claimed damages from insurance companies, which agreed to compensate part of the NT$4.6 billion (US$148 million) in loss according to without-prejudice article in insurance policy.

The firm has secured promises from substrate suppliers including Phoenix Precision Technology Corp. in supplying flip-chip packaging substrates. It has acquired Nanya PCB Corp.’s supply of flip-chip substrates for 600,000 chips this month.


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