Global chipmaking gear sales down 20.0% in July

September 16, 2005 – Global sales of chipmaking equipment in July fell 20.0% from a year earlier to 2,798.05 million dollars, posting the sixth consecutive fall, according to data released by the Semiconductor Equipment Association of Japan (SEAJ) on Wednesday, reported the Jiji Press.

SEAJ officials downplayed the July sales decline, saying that the drop was a reaction to the strong sales of the year before. By region, sales in South Korea grew 23.0% on chipmakers’ active investments. But elsewhere, sales were down 65.2% in China, 31.7% in Taiwan, 24.9% in Europe, and 1.9% in North America. In Japan, sales dipped 0.7%.

By product, sales of wafer-processing equipment decreased 15.8% and sales of assembly equipment fell 30.8%.


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