IC Interconnect Now Offers Back-end Services

(September 19, 2005) Colorado Springs, Colo. &#8212 IC Interconnect (ICI) is now offering wafer test, laser marking, die singulation, and tape-and-reel capabilities as standard services. The equipment set gives ICI installed capacity to process approximately 2 million bumped die per week for small- to moderate-volume processing of 100 to 500 wafers/week.


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