Intel building out 200mm US fabs

September 19, 2005 – Intel Corp. said it will invest $345 million for upgrades to its wafer fabs in Massachusetts and Oregon, just a month after agreeing to build a new $3 billion 300mm fab in Arizona.

Under the plans, Intel will spend $190 million to add a second cleanroom to its Fab 23 in Colorado Springs, for final processing of microprocessors produced on 300mm wafers at other locations prior to final testing and packaging. Construction is set to begin immediately, with projected startup in 2H07. Another $155 million will be spent on Fab 17 in Hudson, MA, which manufactures logic products including chipsets for mobile, desktop, and server systems, adding capacity through new equipment purchases and reconfiguring the factory. Intel also said it has chosen to open a design center in Ft. Collins, CO, to house part of its Itanium processor design team.

Intel also is building an annex to its Ronler Acres campus in Hillsboro, OR, later this year, according to the Business Journal of Portland. The company will invest $4 million on the annex and $10 million for a water treatment building, plus another $15 million for equipment.


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