Advanced Packaging Salutes Innovative Excellence

It is with great pleasure that once again, Advanced Packaging Magazine congratulated the participants and winners of the 2005 Advanced Packaging Awards (APAs). This was the 5th annual APA ceremony in a program that has become a leading industry event, as well as a prestigious recognition for companies devoted to innovations in semiconductor packaging. From the beginning, SEMI and Advanced Packaging have worked together to award creative advancements in technology, and the result of our efforts can be seen in the overwhelming support from the packaging industry.

This year in San Francisco, during SEMICON West, on July 13, 2005, in the Regency Ballroom, the winners were announced in 20 categories. Judges from a distinguished panel comprising industry experts and members from academia chose the winners. The panel looked at submissions based on the ability to meet a significant industry challenge; a creative application of a new or existing technology; overall quality and consistency of performance; economic merits and throughput characteristics. Products were judged on their innovativeness, cost-effectiveness, quality contribution, ease of use, maintainability/reparability, technical advancement, speed/throughput improvements, and environmental responsibility. An APA crystal display was presented to the winning companies.

Jay Regan, our publisher, welcomed all attendees to the event. The Regency Ballroom, with its carved wood walls, arches, and ornate suspended lighting created the right balance of elegance – so fitting for this industry celebration. We found it suitable to recognize such an evolving technological industry as ours in such a monumental, timeless building. It reminds us that despite changes in the industry, a firm foundation will keep us steadfast.

After the presentations, guests enjoyed hors d’oeuvres and cocktails, and discussed the changes they have seen at SEMICON West throughout the years. For this celebration, Advanced Packaging teamed up with one of its sister publications focused on front-end assembly, Solid State Technology. David Barach, publisher of Solid State Technology, welcomed all attendees, suggesting that this dual celebration become a new, yearly tradition at SEMICON West. Bringing award celebrants from the packaging industry together with a range of semiconductor manufacturing companies was an enjoyable way to unite a large portion of the electronics manufacturing industry into one room for a relaxed evening.

In the following pages, you will find presentations recognizing the winners of this year’s awards. Take a few minutes to read about these creative new products and the companies who are behind these investments in R&D. Next year, we invite all companies involved in the back-end packaging process to submit their product or service to the 2006 APAs. Simply fill out the registration form and follow the step-by-step instructions to be listed on the website ( Then join the winners’ circle as you keep the spirit of ingenuity alive.

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Congratulations to this year’s winners.

Gail Flower
Advanced Packaging Editor-in-Chief


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