October 25, 2005 – Intel Corp. has announced plans to invest $650 million to increase the capacity of its 300mm wafer Fab 11X in Rio Rancho, NM. Construction and new tool installations are scheduled to continue through 2006, with production operations set to begin through the new expansion in early 2007. This investment will create more than 300 new manufacturing jobs.
This investment is part of Intel’s strategic goal to increase manufacturing on 300mm wafers that use 90nm, 65nm, and future process technologies. Intel’s 300mm facilities are Fab 11X in New Mexico, D1D and D1C in Oregon, and Fab 24 in Ireland.
“With each subsequent technology process, Intel improves its designs to further reduce impacts to the environment,” said Tim Hendry, Intel Technology and Manufacturing VP and Fab 11X factory manager. “Manufacturing with 300mm wafers uses 40 percent less energy and water per chip.”