New Wire-bonding Process for High-temp Applications Available

ICI normally uses a 0.1-µm-thick gold layer, where others reportedly require at least 1 µm of gold or thicker. “Many people don’t believe that a thinner gold layer can hold up to the stress and abuse caused by their application,” claims Christine Jauernig, process engineer for ICI. “Products made with our Ni/Au process have been tested and qualified by several customers.”

(October 19, 2005) San Diego, Calif. &#8212 KIC has redesigned its website’s homepage to provide a straightforward layout where visitors can learn about KIC’s solutions. The redesign aims to aid the transition to lead-free production and includes such lead-free highlights as KIC’s Lead-free Seminar Series and the KIC Advantage, which provides an overview of KIC and its technologies.

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