SUSS announces trio of wafer bonder orders

Oct. 27, 2005 — SUSS MicroTec, an equipment supplier for MEMS manufacturing and testing, received three purchase orders from leading device manufacturing companies for its production wafer bonder ABC200.

The orders, which the company says were worth a total of more than $4 million, were received in September and October and are follow-on orders due to capacity expansions. The systems are scheduled to be shipped by the end of this quarter and early next quarter and will be installed in Europe, North America and Taiwan. The tools are being used for display and automotive applications in direct, triple stack anodic and thermal compression bonding processes.


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