(November 22, 2005) Stamford, CT — FEINFOCUS, a COMET business unit, and Xradia, a developer of ultra-high-resolution X-ray imaging systems for 3-D tomography, have joined forces to develop an advanced 3-D X-ray inspection technology for the semiconductor packaging and medical device industries. The microXCT defect detection system uses non-destructive 3-D tomography to view the complete structure of advanced packages, scanning packages in 3-D at full resolution.