New Copper IPD Process Suits RF Wireless Systems Miniaturization

(November 21, 2005) Fremont, Calif., and Singapore &#8212 STATS ChipPAC Ltd. has qualified a copper process for integrated passive devices (IPDs) for miniaturization in RF wireless systems. Since the wireless market has to optimize size, performance, and cost, passive integration technology offers advantages for such applications as GSM/DCS and CDMA cell phones, Wireless LAN 802.11 a/b/g, and WiMax systems, primarily in RF power amplifiers and front-end modules (FEMs), which are a critical part of those systems.


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