Purdue selects SUSS wafer bonding equipment for nanotech lab

November 11, 2005 – Purdue University has purchased a SUSS MicroTec SB6e substrate bonder and a MA/BA6 mask/bond aligner for use in its new Birck Nanotechnology Center. This facility provides state-of-the-art laboratory environments and scientific equipment for nanoscale research that will be used by over 130 faculty and their students from 27 departments.

Purdue dedicated the 187,000 square foot center building on October 8, with the goal of positioning their institution as a leader in nanotechnology studies.

“We are proud to be a part of the further education and exploration into the nanotechnology field with the sale of these tools to Purdue University,” said Michael Kipp, GM for the Substrate Bonder Division at SUSS MicroTec.

The SB6e is capable of up to 1 micron post-bond alignment and has a precisely controlled bond chamber atmosphere. The MA/BA6 tool is a high precision front-to-backside alignment tool. Additionally, the BA6 can be configured to allow room temperature direct (fusion) bonding to be achieved with post-bond alignment accuracies of 0.5 micron.


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