Nov. 11, 2005 — SUSS MicroTec announced that Purdue University has purchased a SUSS SB6e Substrate Bonder and a MA/BA6, Mask/Bond Aligner for use in Purdue’s new Birck Nanotechnology Center.
SUSS says the SB6e is capable of up to 1 micron post bond alignment and with its precisely controlled bond chamber atmosphere is intended to allow for superior performance and yields. The MA/BA6 tool is a high precision front to backside alignment tool.
Purdue dedicated the 187,000-square-foot Birck center building on October 8, with the goal of positioning the institution as a leader in nanotechnology studies. This facility provides laboratory environments and scientific equipment for nanoscale research that will be used by over 130 faculty and students from 27 departments.