Dec. 8, 2005 – ASML Holding NV (ASML) announced it has made significant progress towards development of both high NA immersion and Extreme Ultra Violet (EUV) lithography technology.
The company presented the first resist images produced by its Twinscan XT:1700i. ASML says qualification of the total system is ongoing and that the first tool will be ready for shipment by the end of the first quarter of 2006. The company claims to have multiple orders for its fourth generation immersion tool and expects to ship between 20 and 25 immersion systems in 2006.
ASML also said it has made progress on its EUV alpha tool development. The company said two alpha tools are under assembly and an initial projection system is being qualified and integrated. ASML plans to ship a 0.25 NA EUV alpha tool in the second quarter to the Interuniversity MicroElectronics Center (IMEC) in Leuven, Belgium, and Albany NanoTech at the State University of New York at Albany, N.Y.