Hymite announces new silicon MEMS package

Dec. 15, 2005 — Hymite, a manufacturer of silicon-based packaging products for MEMS and electronic devices, announced the availability of its HyCap S — QFN/SON, a packaging product that offers a small, hermetic MEMS and IC package that is conformant with standard specifications for high volume applications.

The company said its silicon encapsulation technology enables manufacturers in markets like handheld devices to integrate MEMS with electronic components and passives into one compact package, shortening development cycles and cutting fabrication time and cost.

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