(December 15, 2005) Kalispell, MT — Wafer processing equipment supplier Semitool, Inc. has installed its third Raider platform at the CEA Leti Nanotec (LETI) in Grenoble, France. This latest version of the Raider single-wafer system will allow LETI to develop and deploy 45- and 32-nm processes for copper-interconnect-related applications on 300-mm wafers using Semitool’s latest ElectroChemical Deposition (ECD) system.
Semitool has previously supplied two Raider systems to LETI, one of which is an advanced front-end-of-line (FEOL) cleaning system for 200- and 300-mm wafers, and the other a plating system for copper interconnect. This suite of tools is part of LETI’s Nanotec 300 program with the objective of developing sub-45-nm processes for the Crolles2 Alliance — STMicroelectronics, Freescale Semiconductor, and Philips Semiconductors. The Nanotec 300 program recently delivered pre-production 45-nm devices using advanced metal gate and high-k gate dielectric materials to the Alliance. Many of the cleaning steps for this advanced process flow were performed on Semitool’s advanced FEOL cleaning Raider SP at LETI.
“We have developed a great deal of confidence in Semitool’s Raider equipment and the process technology and flexibility it gives us,” says Olivier Demolliens, Head of Nanotec at LETI. “This cooperation enables us to remain ahead of the microelectronic technology roadmap.”
“Our cooperation with CEA Leti in the development of copper interconnect processes for the future nodes has demonstrated the versatility and effectiveness of the Raider platform, and provided validation of the process technology Semitool offers,” says Paul Siblerud, Semitool’s VP of ElectroChemical Deposition Technology. “The scientists and engineers at CEA Leti are world-class, and bring an in-depth understanding of the challenges and requirements of next-generation device architectures. We look forward to the next phase of our work with CEA Leti as we jointly pursue copper processes for 32 nm and beyond.”