Board Transport System

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DEK’s Rapid Transit Conveyor (RTC) transport system integrates DEK’s Micron-class Europa high accuracy mass imaging system to deliver a 4-second core cycle time. The RTC uses stepper motor technology to increase board transport speed and replaces traditional belt-type transfer with a positive retention mechanism that does not rely on friction for board retention. When paired with DEK’s HawkEye print verification system, RTC allows manufacturers to realize 100% board inspection at line-beat rate, increasing both throughput and end-of-line yield. DEK International GmbH, Zurich, Switzerland, www.dek.com.

Thermally Conductive Adhesives

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Loctite Bead-on-Bead is a 2-part, no-mix, no-measure acrylic adhesive chemistry based on proprietary structural adhesive technology. Each of the two parts can be applied to the component independently so that mixing occurs only when the two items to be bonded are joined together. This replaces traditional pre-mixing or solvent-activated systems, eliminates issues associated with pot-life management, and represents dramatic increases in resource utilization for manufacturers. The new technology offers a 40% improvement in cooling performance, and allows manufacturers to use smaller, more cost-effective heatsinks. The Electronics Group of Henkel, Irvine, CA, electronics.henkel.com.

X-ray/Failure Analysis

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The Concept FX modular, multi-purpose X-ray inspection and failure analysis system offers 30 configurations, and provides bare board, assembly, and package inspection; prototyping; process validation; and rework verification. A no-clamp sample tray provides fast load and unload. Off-axis inspection is accomplished by rotating the X-ray source and detector around the sample tray, eliminating the need for clamping the samples. A high-resolution, high-magnification imaging train includes near-microscopic interlayer electrical interconnection inspection of wire-bond and die attachments. FocalSpot Inc., San Diego, CA, www.focalspot.com.

High-volume Rework

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Fineplacer Micro HVR addresses high-volume rework for such repair challenges as component failure, assembly error, device revision, and firmware updates. The system automatically sequences component de-solder and discard, residual solder removal, flux dispense, and component re-solder without operator intervention. The FINETECH pivot arm, with component rotation capability, is automated for hand-free placement with defined force via Z-axis motion of the substrate. With placement accuracy better than 10 µm, the system suits large super BGAs to finest-pitch, smallest-bump CSPs and flip chips. An additional fast linear axis accommodates large substrates, and provides for component storage in trays, tape, gelpaks, or waffle paks. Finetech Inc., Phoenix, AZ, www.finetech.com.

Selective Soldering

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A machine for either batch or in-line capabilities, the Juki 400 offers an alternative to traditional wave solder equipment in lead-free manufacturing. A 3-stage in-line system for high-speed, automated soldering processes, the system may be customized to meet specific requirements. Multiple solder pots run both leaded and lead-free soldering without requiring a hardware change. A maximum of four mini-wave nozzles are available for different configurations. A traditional full wave up to 400 mm can be installed and run during the same process. Its XY Fluxer option allows the system to flux, pre-heat, and solder simultaneously. A Tenifer nitrate process protects from de-alloying by using forced, hot-air nitrogen at the mini-wave to lower the temperature of the solder and decrease the time of contact. Juki Automation Systems, Morrisville, NC, www.jas-smt.com.


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