The GBC conference’s line-up also includes:
(January 30, 2006) Hsinchu, Taiwan — ChipMOS Technologies Ltd.’s 69.8% owned subsidiary, ChipMOS Technologies Inc., has signed a one-year BGA substrate supply agreement with RYOWA Co. Ltd, under which RYOWA will provide a minimum of 30 million pieces of BGA substrates per month. The agreement targets manufacturing DDR2 memory packages.
“We are encouraged to see the recent pick-up in DDR2 memory finally happening after several years of delays,” says S.J. Cheng, ChipMOS’ chairman and CEO. “This will likely become mainstream around the end of first half of this year. Based on our customers’ current forecasts, it was necessary to secure a high-quality, high-volume supply of BGA substrate to meet the anticipated increasing demand for DDR2 packaging.”