IBM, Sony, Toshiba push partnership to 32nm

January 12, 2006 – IBM Corp., Sony Corp., and Toshiba Corp. have extend their multiyear agreement for 300mm-90nm/65nm process technologies to include development for the 32nm node and beyond.

Research and development will be done at Albany NanoTech and IBM’s facilities in Yorktown Heights, NY, with manufacturing at IBM’s 300mm fab in East Fishkill, NY. The trio have collaborated on development of the “Cell” SOI-based processor over the past five years.

Toshiba has developed a separate alliance with NEC targeting 45nm development with bulk silicon, in addition to its IBM-Sony pact focusing on SOI.


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