Infineon, SMIC extend DRAM pact

January 10, 2006 – Semiconductor Manufacturing International Corp. (SMIC) and Infineon Technologies AG have extended an agreement under which Infineon transfers its 90nm DRAM trench technology and 300mm production knowledge to SMIC, to include flexibility for future 70nm technology transfers.

Final qualification is expected to occur in 3Q06, with migration to 300mm capacity currently dedicated to Infineon’s 110nm DRAM products to 90nm. The original deal was signed in Dec. 2002.


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