Hueners has experience and engineering knowledge in the microelectronics, microelectronic packaging, and interconnects; microwave and RF; and optoelectronics fields. He collaborated in developing laser interferometric measurement and die attach and wire bond systems and processes, has written more than 50 technical papers, and currently serves on Advanced Packaging‘s Editorial Advisory Board. He is on the Board of Directors of the San Diego World Trade Center, and represented San Diego on their recent trade mission to China.
(January 23, 2006) Herndon, VA — In conjunction with the APEX/IPC Printed Circuits Expo/Designers Summit 2006 exhibition and conference, to take place February 8–10, 2006, in Anaheim, CA, the International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, will kick off its 2007 Roadmap meeting on February 6–7. Several iNEMI project activities and results also will be discussed in conference forums and technical sessions.