Soitec, AMD extend 300mm wafer pact

January 16, 2006 – Soitec, Bernin, France, has signed a $150 million deal to supply silicon-on-insulator wafers to AMD, extending a $50 million pact signed in 2005. The agreement is part of a multiyear contract to supply 200mm and 300mm silicon-on-insulator wafers, manufactured using Soitec’s Smart Cut process.


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