TSMC shrinks 90nm production process to 80nm

January 17, 2006 – Taiwan Semiconductor Manufacturing Corp. (TSMC) has entered full production of 80nm “half-node” process technology, a lithographic shrink of its 90nm process technology. The process supports most of the foundry’s and third-party libraries and IP; design rules also are a linear shrink from 90nm. ATI and nVidia both stated support for the 80nm process, which TSMC says reduces overall design sizes by up to 19% and reduces cost-per-die by more than 20%.

The first 80nm process in production is TSMC’s high-performance GT process, to be followed in Feb. by its high-speed HS process and the low-power LP process in March. A special GC process, offering low active and standby power advantages, will be available in 3Q06.


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