Amkor opening Singapore wafer-bump shop

February 27, 2006 – Amkor Technology Inc., Chandler, AZ, said that it is adding wafer bumping operations to its existing test operations in Singapore, using “copy-exact” processes currently used in bumping operations by its Unitive subsidiary in Taiwan.

The site will begin offering 300mm/90-65nm wafer bump and probe services in 2H06. Capital contribution to the facility’s first phase of development is already included in the company’s preliminary capital expenditure budget for 2006, according to Oleg Khaykin, COO.

The company has invested nearly $80 million in its Singapore operations, and aims to achieve $200 million total investment over the next several years, Khaykin added.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.