(February 27, 2006) Chandler, AZ &#8212 Amkor Technology plans to begin its wafer-bumping operations in Singapore later in 2006, providing wafer-bump and wafer-probe services to support emerging applications on 300-mm wafers at 90- and 65-nm nodes, and using the same processes currently employed by Amkor’s Unitive subsidiary in Taiwan. Together with its existing test operations in Singapore, Amkor also will offer a full suite of its 300-mm wafer-bumping services with its existing bumping operation in Taiwan.