Amkor to commence wafer bumping in Singapore

Feb. 27, 2006 – Amkor Technology Inc. (NASDAQ: AMKR) announced that it is establishing wafer bumping operations in Singapore using the same processes currently employed by Amkor’s Unitive subsidiary in Taiwan.

Amkor’s Singapore bump facility is expected to commence operations in the second half of 2006 and will provide, in conjunction with Amkor’s existing test operations in Singapore, wafer bump and wafer probe services to support emerging applications on 300mm wafers at the 90nm and 65nm process nodes.


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