FlipChip starts work on Chinese backend facility

February 13, 2006 – FlipChip International LLC has begun construction of a new jointly owned advanced bumping facility in Shanghai, to provide wafer-level packaging and flip-chip bumping services. The JV, owned by FlipChip and Millennium Microtech (Shanghai) Co. Ltd. (MMS), will be named “FCMS” and located at MMS’ existing facility in the Pu Dong district.

“The domestic consumption of flip-chip devices is expected to maintain double digit growth for the next three years, and is an essential packaging technology for wireless portable devices and video phones,” noted Bob Forcier, president and CEO of FlipChip International, in a statement.


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