IMT installs new SUSS wafer bonder

Feb. 22, 2006 — SUSS MicroTec, a supplier of precision manufacturing equipment for the semiconductor and emerging markets, announced the new installation of an additional wafer bonding system at Innovative Micro Technology (IMT) in Santa Barbara, Calif.

IMT required additional wafer bonding capacity as part of its ramp up to volume production on several new MEMS products. These include novel patented IR emitters as well as MEMS switch products, both of which are now in production at IMT’s wafer fab.


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