Japan chemical firm buys German backend tool firm

February 10, 2006 – Nagase and Co. has acquired a 60% stake in German wafer bumping and packaging subcontractor Pac Tech GmbH for an undisclosed amount, in an effort to expand its business into backend semiconductor manufacturing markets, according to the Nikkei Business Daily.

Pac Tech focuses on bumping and packaging based on electroless metallization, with a second business unit specializing in equipment for laser bonding and bumping. The company doubled sales in 2005 to roughly 14 million euros. Nagase has sold Pac Tech equipment and licenses in Japan since 2000.


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