PennWell names David Barach group publisher of Solid State Technology and Advanced Packaging

February 9, 2006 — PennWell Corporation has named veteran publisher David Barach to the position of group publisher of Solid State Technology and Advanced Packaging Packaging magazines, effective February 1.

For the past five years, Barach has led the Solid State Technology franchise, which includes Solid State Technology, Microlithography World, WaferNews, four international publications, three E-Newsletters, and an array of compelling digital media vehicles. Solid State Technology focuses on front-end semiconductor manufacturing processes, while Advanced Packaging Packaging concentrates on final assembly, packaging, and testing. The synergies between the two publications will create a powerful franchise for all advertisers and readers immersed in the entire semiconductor manufacturing industry. Given Solid State Technology‘s total circulation of approximately 42,000 audited subscribers, plus an Asian reach of more than 50,000 buyers, as well as Advanced Packaging Packaging’s 22,000+ subscribers, there is no other global media network that can provide this type of competitive edge to the marketplace.

“For nearly 50 years, Solid State Technology has reigned as the premier technical publication covering the global semiconductor market,” says Mark Finkelstein, Senior Vice President, PennWell. “Creating one of the largest franchises within PennWell, the aligned Advanced Packaging Packaging and Solid State Technology brings a renewed emphasis on the growth and transformation within the semiconductor industry. Our Asian partner publications in China and Taiwan have already combined efforts of the fabs and foundries that include final manufacturing, and we are following suit. With his extensive knowledge and insight, David is the right publisher to lead the charge of our highly respected editorial staff and selling teams.”

“This is a wonderful time for Advanced Packaging Packaging magazine,” states Gail Flower, Editor-in-Chief. “The current staff is still at the helm, with the added benefit of a greater reach through editorial expertise from Solid State Technology. In the future, look for changes in style, additional original articles, and an expanded global editorial reach into technological challenges. We make this change at a time when packaging is finally getting industry recognition as an area where things really do happen in a smaller, faster, cheaper format. We will be the first to report on and discuss these technological challenges.”

“I am thrilled and honored to lead the Advanced Packaging Packaging and Solid State Technology franchises,” states Barach. “Each brand has earned the highest degree of respect and credibility within the industry. Now, with the opportunity to combine efforts — to better serve readers, online users, advertisers, and the marketplace in general — Advanced Packaging Packaging and Solid State Technology will provide a greater, more distinctive value from which all parties will benefit. Furthermore, with the additional investments being made in our Asian partner publications — AP/SST Taiwan and AP/SST/NMD China — we provide unbeatable synergy between these vibrant international media networks. The future is bright for Advanced Packaging Packaging and Solid State Technology, and we look forward to better serving the needs of the worldwide semiconductor manufacturing community.”

About Advanced Packaging Packaging Advanced Packaging Packaging is dedicated to providing its readers with the best technical information on semiconductor packaging in a practical, useful format. Our experienced staff provides the best resources for packaging professionals, including a website with additional industry-specific information, daily news updates, a bi-weekly E-Newsletter, and a product resource guide on the website. Our mission is to ensure that Advanced Packaging Packaging continues to be the essential resource for electronic packaging applications. For more information, visit

About Solid State Technology Solid State Technology serves engineers and engineering managers all over the globe in semiconductor/thin film manufacturing, with in-depth, technical authoritative information on the latest advances in processes and materials for fabrication of integrated circuits, discretes, and other thin-film devices. Solid State Technology also covers metrology, robotics/automation/wafer handling, fab software, yield improvement, contamination control, vacuum technology, and other allied technologies for semiconductor/thin-film processing plants, as well as fab management topics. WaferNews is Solid State Technology‘s weekly newsletter that is received by executives in the semiconductor equipment and materials industry. For more information, visit

About PennWell Corporation
PennWell Corporation is a diversified business-to-business media and information company that provides quality content and integrated marketing solutions for the following global industries: Oil and gas, electric power, water, electronics, semiconductor, contamination control, optoelectronics, fiber optics, computer graphics, enterprise storage, information technology, fire, emergency services, and dental. Founded in 1910, PennWell publishes 75 print and online magazines and newsletters, conducts 60 conferences and exhibitions on six continents, and has an extensive offering of books, maps, directories, websites, research, and database services. In addition to PennWell’s headquarters in Tulsa, Oklahoma, the Company has offices in Nashua, New Hampshire, Houston, Texas, London, England, and other locations worldwide.

For more information, please contact: Carol Fronduto-Dirksen 603-891-9169 [email protected]


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