Mar. 21, 2006 – The University at Albany’s College of Nanoscale Science and Engineering on Monday received nearly $2 million to fund development of three-dimensional integrated circuits and to recruit a top researcher from the West Coast.
The Times Union in Albany reported that the money comes from the New York State Office of Science, Technology and Academic Research, or NYSTAR. The goal, said Russell W. Bessette, NYSTAR’s executive director, is to help the technology progress to the point where it will create new jobs.
A portion of the funds will pay for the creation of a new Consortium for Hyper-Integration and Packaging that will research and develop the three-dimensional circuits, aligning and stacking 300-millimeter-diameter wafers to fabricate the semiconductors in a nearly 1-acre clean room at the Albany NanoTech complex, which includes the college and private and academic research facilities.
The consortium received $1.14 million for its work, which will involve more than 30 researchers. The remaining $750,000 was used to help recruit Patrick Naulleau from the Lawrence Berkeley National Laboratory in California. Naulleau will focus on extreme-ultraviolet lithography, using light of extremely short wavelengths to etch ever-smaller components and circuits on a wafer.