March 21, 2006 – FSI International Inc., Chaska, MN, has debuted new technology that it says eliminates the need for ashing on photoresist stripping steps, reducing surface damage and material lost, ultimately saving cycle times and money.
The ViPR technology uses a uniquely designed spray processing system with a combination of chemical blending, delivery, and temperature controls to enable removal of highly-implanted photoresist, including on 1×1017 ions/sq. cm plasma doped (PLAD) photoresist, and eliminate approximately 80% of frontend-of-line ashing steps. The technology is available on FSI’s ZETA G3 spray cleaning platform, which uses centrifugal spray and chemical delivery processes to prepare chemicals at a controlled composition and temperature for dispensing directly onto wafers.
Initial ZETA systems with ViPR technology shipped in March, stated Don Mitchell, FSI chairman and CEO.