March 7, 2006 – An international holding company is proposing to build a $300 million 200mm fab in Beijing, with about $100 million in government help in construction and land, according to the Financial Times.

The proposed site would make chips on a contract basis for local design ships and international electronics groups. Construction would begin in the next month, with eventual capacity of 30,000 wafers/month.

The report quoted a company representative saying that the Beijing city government and suburban Linhe Industrial Development Zone have promised “substantial support,” including help building the fab as well as the surrounding land, together worth about $100 million.

Samoa-registered firm Fullcomp International Investment also reportedly would establish its own design house and marketing companies, and use state aid to help build a separate facility for refurbishing secondhand chipmaking equipment, for the main fab as well as other Chinese fabs.