Honeywell debuts flexible phase-change material

March 17, 2006 – Honeywell Electronic Materials has developed a new screen printable phase-change material to give chipmakers more flexibility in applying the heat-conducting materials during the semiconductor packaging process.

Phase-change materials change from a solid to semi-solid or liquid state to fill microgaps between the chip and material to more efficiently transfer heat from the chip to another are or dissipated into the air. Typically these materials are supplied in traditional tape formats supplied on a roll, and affixed to the desired area in small pads.

Honeywell says its new product, designated as PCM45F-SP thermal interface material, can be applied in a variety of different shapes depending on the chip design (screen print).


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